ultrapaul
Member of the Trade: Ultrasone
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Ultrasone Debuts First PRO Series Headphone with S-Logic™ Plus Technology
New PRO 900 headphone feature titanium-plated drivers, velvet earpads & new technology for improved tonal perception.
Wildomar, Calif. - (August 28, 2008) – Ultrasone Inc., distributor for German headphone manufacturer Ultrasone AG, is proud to announce the first headphone in the PRO Series with S-Logic™ Plus technology: the PRO 900. This new technology results in an impartial acoustic feeling that allows the listener even more of a spacious tonal perception, resulting in a headphone experience that is second to none.
Ultrasone’s PRO 900s are closed-back headphones that boast a classic black design, velvet covered black and silver ear pads and a diamond-cut logo insignia. The PRO 900 features a new 40mm titan-plated driver and a new soft USC-Cable that is paired with Neutrik connectors. Ultrasone’s newest headphones contain MU-Metal shielding (ULE technology) that reduce the amount of radiation directed to the listener by up to 98%, as compared to conventional headphones. The new headphones also contain Ultrasone’s patented S-Logic™ Plus technology for reduced sound pressure on the ear drum and improved tonal perception. Ultrasone’s PRO 900 comes in a hard-sided carrying case along with two removable cables (one spiral and one straight) and spare ear pads.
The headphones have a MSRP of $599.00 and will be available from Ultrasone’s network of dealers and at Ultrasone.
S-Logic™ Plus Technology
S-Logic™ Plus is the newest advancement in the S-Logic™ Natural Surround System. By acoustically redesigning the earcups, Ultrasone has squeezed a large soundstage into a more streamlined ear-cup. S-Logic™ Plus profits directly from innovations developed for Ultrasone’s flagship Edition range. This sophisticated new technology combines precision dampening with micro-acoustic reinforcement, allowing driver, buffer-board, and spatial parameters to complement one another in an optimal manner. The result is a most neutral sound impression with more vivid perception of voices and instruments.
PRO 900 Technical Specifications:
•S-Logic™ Plus Natural Surround Sound
•Dynamic principle
•Frequency range 6-42k Hz
•Impedance 40 Ohm
•Sound pressure level 96 dB
•Driver 40 mm Titanium Plated
•Weight 295 g (without cord)
To learn more about Ultrasone, go to Ultrasone
About Ultrasone
Based near Munich, Germany, Ultrasone AG has been manufacturing headphones for the audio market for over 17 years, during which time the company has developed and applied for more than 60 patents for its innovative technology. The company's unique, patented S-Logic™ technology creates natural surround sound without the use of additional electronic devices. Ultrasone headphones represent a safer listening experience by reducing sound pressure on the ear drum by up to 40% and also by offering shielding from EMF radiation up to 98% through the use of patented ULE (ultra low emission) technology. For more information about Ultrasone headphones, go to Ultrasone.
New PRO 900 headphone feature titanium-plated drivers, velvet earpads & new technology for improved tonal perception.
Wildomar, Calif. - (August 28, 2008) – Ultrasone Inc., distributor for German headphone manufacturer Ultrasone AG, is proud to announce the first headphone in the PRO Series with S-Logic™ Plus technology: the PRO 900. This new technology results in an impartial acoustic feeling that allows the listener even more of a spacious tonal perception, resulting in a headphone experience that is second to none.
Ultrasone’s PRO 900s are closed-back headphones that boast a classic black design, velvet covered black and silver ear pads and a diamond-cut logo insignia. The PRO 900 features a new 40mm titan-plated driver and a new soft USC-Cable that is paired with Neutrik connectors. Ultrasone’s newest headphones contain MU-Metal shielding (ULE technology) that reduce the amount of radiation directed to the listener by up to 98%, as compared to conventional headphones. The new headphones also contain Ultrasone’s patented S-Logic™ Plus technology for reduced sound pressure on the ear drum and improved tonal perception. Ultrasone’s PRO 900 comes in a hard-sided carrying case along with two removable cables (one spiral and one straight) and spare ear pads.
The headphones have a MSRP of $599.00 and will be available from Ultrasone’s network of dealers and at Ultrasone.
S-Logic™ Plus Technology
S-Logic™ Plus is the newest advancement in the S-Logic™ Natural Surround System. By acoustically redesigning the earcups, Ultrasone has squeezed a large soundstage into a more streamlined ear-cup. S-Logic™ Plus profits directly from innovations developed for Ultrasone’s flagship Edition range. This sophisticated new technology combines precision dampening with micro-acoustic reinforcement, allowing driver, buffer-board, and spatial parameters to complement one another in an optimal manner. The result is a most neutral sound impression with more vivid perception of voices and instruments.
PRO 900 Technical Specifications:
•S-Logic™ Plus Natural Surround Sound
•Dynamic principle
•Frequency range 6-42k Hz
•Impedance 40 Ohm
•Sound pressure level 96 dB
•Driver 40 mm Titanium Plated
•Weight 295 g (without cord)
To learn more about Ultrasone, go to Ultrasone
About Ultrasone
Based near Munich, Germany, Ultrasone AG has been manufacturing headphones for the audio market for over 17 years, during which time the company has developed and applied for more than 60 patents for its innovative technology. The company's unique, patented S-Logic™ technology creates natural surround sound without the use of additional electronic devices. Ultrasone headphones represent a safer listening experience by reducing sound pressure on the ear drum by up to 40% and also by offering shielding from EMF radiation up to 98% through the use of patented ULE (ultra low emission) technology. For more information about Ultrasone headphones, go to Ultrasone.
